Last edited by JoJoshakar
Thursday, July 30, 2020 | History

2 edition of Stability of composites formed by sputter deposition of thin copper and molybdenum layers. found in the catalog.

Stability of composites formed by sputter deposition of thin copper and molybdenum layers.

James Willard Patten

Stability of composites formed by sputter deposition of thin copper and molybdenum layers.

by James Willard Patten

  • 276 Want to read
  • 10 Currently reading

Published .
Written in English

    Subjects:
  • Metallic composites.,
  • Strength of materials.

  • The Physical Object
    Paginationx, 94 l.
    Number of Pages94
    ID Numbers
    Open LibraryOL16738911M

    disadvantages=the relative percentage of elements in the coating will be different than from the composition of the exposed area on the target. the sputtering speed of . Molybdenum titanium sputter targets are provided. In one aspect, the targets are substantially free of the β(Ti, Mo) alloy phase. In another aspect, the targets are substantially comprised of single phase β(Ti, Mo) alloy. In both aspects, particulate emission during sputtering is reduced. Methods of preparing the targets, methods of bonding targets together to produce large area sputter.

      Sputter deposition is a physical vapor deposition method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically argon).The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.   Preparation of CIGS thin films by sputtering process. Deposition of CIGS junction on a soda lime glass substrate covered by Mo layer at 1 μm thick. The best back contact material for CIGS solar cells was found to be molybdenum since it is having high conductivity and relative stability at the high processing temperature.

    formed by sputter deposition through a metal mask of Al dots on AlN film as top electrode and a continuous Al film on Si wafer backside as bottom electrode. The thickness of the films measured using stylus pro-filometer for 2, 4, 6, 8 minutes of deposition time w 81, , nm respectively. The type of crystalline.   Vacuum deposition is a generic term used to describe a type of surface engineering treatment used to deposit layers of material onto a substrate. The types of coatings include metals (e.g., cadmium, chromium, copper, nickel, titanium) and nonmetals (e.g., ceramic matrix composites of carbon/carbon, carbon/silicon carbide, etc.), deposited in thin layers .


Share this book
You might also like
Color and, und, et communication

Color and, und, et communication

Non-Euclidean geometry.

Non-Euclidean geometry.

Words on a page

Words on a page

From Weimar to Auschwitz Essays in German History

From Weimar to Auschwitz Essays in German History

A Sister for sucking

A Sister for sucking

Magic Tree House Collection

Magic Tree House Collection

The Italians in Canada

The Italians in Canada

The Federal almanac, and ephemeris ... for the year of our Lord, 1791 ...

The Federal almanac, and ephemeris ... for the year of our Lord, 1791 ...

Daybrightener

Daybrightener

25 years

25 years

Kick-start

Kick-start

Arizona intergovernmental structure: a financial view to 1980.

Arizona intergovernmental structure: a financial view to 1980.

Development of the space operations incident reporting tool (SOIRT)

Development of the space operations incident reporting tool (SOIRT)

Corals

Corals

Stability of composites formed by sputter deposition of thin copper and molybdenum layers by James Willard Patten Download PDF EPUB FB2

Thin film Cu(In,Ga)Se2 (CIGS)-based solar cells with relatively high efficiency and low material usage might become a promising alternative for crystalline silicon technology. The most challenging task nowadays is to decrease the PV module fabrication costs by application of easily scalable industrial process.

One of the possible solutions is the usage of magnetron sputtering. Thin films within the immiscible binary Cu-Mo system were synthetized by d.c. magnetron sputter co-deposition and studied over the entire composition range. The Si substrates were sputter-cleaned in an Ar plasma by applying a voltage of − V for 10 min to remove the native oxide.

Cu is known to react with Si to form Cu 3 Si in the early deposition stage of Cu on Si at RT and its amount significantly increases with rising both the thermal and kinetic energy provided by the growth conditions Cited by: 4.

Molybdenum nitride thin films were deposited by the atomic layer deposition technique within a temperature range of degrees C from molybdenum.

TEM cross sections of copper molybdenum thin layered material: (a)as sputtered, dark layers are molybdenum, light layers are copper, each layer is approximately 80 A thick: (b) heat treated for 4 h atthe molybdenum has spheroidized (dark areas indicated by the left arrow) in a twinned copper matrix (right arrow).

disadvantages and Cited by: 8. Molybdenum disulphide (MoS 2) is a layered chemical compound comprised of covalently bonded, hexagonally coordinated S–Mo–S layers, bonded to neighbouring layers by weak van der Waals of the unique features of MoS 2 is the polymorphism with distinct electronic ing on the arrangement of S atoms, several distinct symmetries may form.

In the literature, a lot of studies focus on the evolution of copper microstructure as function of the deposition method and its process parameters variations, especially for DC magnetron sputtering. Studies on the resistivity evolution as function of film thickness or process parameters are also found [5], [18], [23], [24], [37], [38].

Thin films have a great impact on the modern era of technology. Thin films are considered as backbone for advanced applications in the various fields such as optical devices, environmental applications, telecommunications devices, energy storage devices, and so on. The crucial issue for all applications of thin films depends on their morphology and the stability.

ELSEVIER Thin Solid Films ( Sputter-deposited MO and reactively sputter-deposited MO-N films as barrier layers against Cu diffusion Jui-Chang Chuang*, Shuo-Lun Tu, Mao-Chieh Chen Depnrtn~ent of Electronics Engineering and the Institute of Electronics, Nntiortnl Chiao-Tung Universi&, Ta Hmeh Road: Hsinchu.

The following are the main factors I found that affect the deposition rate of aluminum when RF sputtering technique is used for film deposition. base pressure 2. sputter pressure. Thin layers containing lithium oxide (Li 2 O), lithium sulfide (Li 2 S), or lithium selenide (Li 2 Se) are relevant for many electrochemical processes in lithium-based batteries.

As a step toward understanding the electrochemical properties of such layers, this work demonstrates the growth of dense single-phase films by both sputter deposition (for Li 2 O. Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer.

Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide. Thin films of molybdenum oxide were deposited on unheated glass substrates using dc magnetron sputtering method by sputtering of molybdenum target in the presence of oxygen and argon gas mixture.

In recent years, magnetron sputtering has been widely utilized as a gas-phase technique for fabrication of metal/graphene hybrids.

The basic components of a sputter chamber, consisting of a powder sample holder, a turbo molecular pump, and an orthogonally oriented sputter gun, are illustrated in Fig.

This “dry” processing technique is capable of not only removing the. Historical footnote: While sputtering was in use for the deposition of thin films by the mids, the etymology of the word sputtering remains unclear.

The term “spluttering,” an intensified form of the English word sputtering, meaning “to spit with explosive sounds” (a cognate for the Dutch word “sputteren”), 41 A pulsed mode sputtering method and system for sputtering a material from a target onto a substrate in a sputtering deposition process to create thin films.

The thin films are created by generating pulsed power from a power supply operated in pulsed mode. The power supply can be either a DC or RF power supply. The pulsed power is applied at full load during the power on. thin film deposition to maximize the level of control.

This forms exactly the goal of this book, i.e. to give the reader on overview of the important pro-cesses during sputter deposition and of the aim to describe them by modelling and to use them to deposit complex materials such as perovskite, solid elec-trolytes and electrochromic thin films.

the deposition of molybdenum thin films by dc sputtering (e.g. [1–5]). However, as the potential portfolio applications of CIGS expand, different films’ properties may be required to adapt to new requirements.

In this paper, we therefore used r.f. magnetron sputtering to deposit Mo thin films on soda-lime glass. the composition of the CrMoN layers.

Chromium and Molybdenum targets were co-sputtered at an optimized sputtering rate to yield uniform Pm thick films of desired Cr Mo N composition on polished CoCrMo biomedical alloy substrates.

The substrate temperature during the deposition was about oC. LAMELLAR COMPOSITES SPUTTER DEPOSITION BERYLLIUM-ALUMINUM COPPER-MOLYBDENUM BERYLLIUM-TITANIUM HICm-AWMINWi TITANIUM-ALUMINUM ABSTRACT (Continue on ravaraa aide II necaaaary and Idenllly by block number) Data and results from the second year's evaluation of two types of lamellar composites is presented.

Chapter 2: Thin Film Deposition 29 films. Improved quality of thin films, surfaces and interfaces have made remarkable advances in thin film based technology [41]. Thin film deposition techniques may be broadly classified as physical vapor deposition (PVD) and chemical vapor deposition (CVD) techniques [17].A discrete model for the prediction of relative ion bombardment flux and target erosion in planar sputtering magnetrons is implemented in COMSOL Multiphysics®.

Planar magnetrons are used within physical vapor deposition (PVD) processes to form thin .LAMELLAR COMPOSITES SPUTTER DEPOSITION COPPER-MOLYBDENUM BERYLLIUM-TITANIUM ABSTRACT (Continue on reverse side II necessary and Identity fc/ block numberj Data and results from the first year's evaluation of two types of lamellar composites is presented and discussed.

DD, ^M73 EDITION OF 1 NOV 65 IS OBSOLETE UNCLASSIFIED.